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the board to keep them in place and to prevent dislodging of the bead from its intended measurement target (see Fig. 47.13). Note that there is no need to seal the drilled hole into which thermocouple is inserted. It is a miniature blind hole largely filled with thermocouple wires.Air transfer within this hole will be negligible. 47.3.10.3.3 Thermocouple Size. Many factors can confound the solder-joint temperature measurement process, regardless of whether the thermocouple bead is properly deployed between lead and pad. Among these are the size of the bead and the thermal mass of the thermocouple assembly. In general, the use of finer-gauge thermocouples such as 30 to 36 American Wire Gauge (AWG) (see Table 47.1) is recommended. This will permit insertion between lead and pad even at very fine lead and pad pitches. Ideally the thermocouple bead will be completely within the solder joint to be measured.

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TABLE 47.1 AWG versus Wire Diameter and Anticipated Thermocouple Bead Diameter Wire diameter (in.) 0.032 0.020 0.010 0.005 Wire diameter (mm) 0.81 0.51 0.25 0.127 Bead diameter (in.) 0.048 0.030 0.015 0.0075 Bead diameter (mm) 1.22 0.76 0.38 0.19

G,. The examples that follow will illustrate the application of this simplified procedure for designing an IMC controller. Example 18.5. Internal model control. Design an IMC controller for the process which, is first-order: G, = K/(Ts + 1) For this case G,, = 1 and G,, = K/(Ts + 1). Applying Eq. (18.18) gives GI = l/G,, = (7s + l)/K In order to be able to implement this transfer function let f(s) = l/(As + 1). The IMC controller becomes 17s+l GI = KAs+l This result is a lead-lag transfer function that can be implemented with modem microprocessor-based controllers. We may now obtain G, from Eq. (18.14)

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5. Hausner, M. J.: Get the Benefits of Sampled Data Control from Modified Process Controllers, Control Eng., March, 1961. 6. Bernard, J. W., and J. F. Cashen: Direct Digital Control-Questions That Must Be Answered, Proc. 19th flnnual ISA Conf., New York, October, 1964.

Strive for the shortest possible length of thermocouple wire pair that is practical for the application. Long, large diameter wire may conduct heat away from the solder joint to be measured, altering its true heating nature. 47.3.10.3.4 Securing Thermocouples: Thermally Conductive Adhesives. If an adhesive is to be used to hold a thermocouple bead, its thermal conductivity must be taken into account. Most thermally conductive adhesives are not nearly as conductive as metal or solder. The best are filled with high thermal conductivity materials such as aluminum, boron nitride, or other

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thermally conductive ceramics If the thermal conductivity is not high enough, a false thermocouple reading will result Thermally conductive adhesives are meant to be applied thinly and conductivity depends on bond-line thickness It is wise to baseline a conductive adhesive against a soldered thermocouple to ensure that it is not insulating and affecting measurement results Also ensure that it survives multiple reflow cycles and still maintains it thermal conductivity Were the adhesive to release the thermocouple bead during the process, then measurement data would be useless Many adhesives will not tolerate the high-temperature environment of soldering or the continuous thermal cycling encountered in trying to adjust a soldering profile This is especially true with the onset of Pb-free soldering and the higher soldering temperatures associated with the move away from lead-bearing alloys High-conductivity adhesives are also expensive 4731035 Securing Thermocouples: Adhesive Tapes.

1 -GIG, Introducing the expressions for GI and G,,, into this equation gives 7s + 1 K(hs + 1) - &++ l) h This result is in the form of a PI controller:

Tape should be avoided for holding the thermocouple bead to the board as it is known to be an unreliable technique Problems arise as the tape heats up and stretches, expands, or even releases from the board, allowing the thermocouple bead to float off its measurement target The tape also shields the thermocouple and target solder joint from the oven ambient, which is contrary to the task at hand measuring the effect of the oven environment on the intended solder-joint location 473836 Securing Thermocouples: High-Temperature Solder Best practice is to use a high-temperature solder to secure the thermocouple bead to its measurement site The bead is not really soldered, as the K-type thermocouple wire is not easily wettable Instead, the solder bead is positioned under a component lead, and the lead is soldered with the high-temperature alloy, merely encasing the bead in the solder.

The chosen high-temperature solder should have melting range or melting point well above the intended peak reflow temperature An alloy such as 10Sn/Pb (melting range near 300 C) is appropriate as SAC solder melts in the vicinity of 220 C and the peak soldering temperature is generally less than 255 C Before applying the high-temperature solder, it is advisable to use a fluxed copper wicking braid to remove any solder associated with normal manufacturing assembly of the board, such as SAC or Sn/Pb, as these may depress the melting range of the high-temperature solder 4731037 Profile Board Components The profile board can be populated with dummy or electrically failed or reject components The board can be used over and over and should be saved.

G, =

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